Catalyst

ABSTRACT

Catalysts comprising nanostructured elements comprising microstructured whiskers having an outer surface at least partially covered by a catalyst material having the formula PtxNiyAuz, wherein x is in a range from 27.3 to 29.9, y is in a range from 63.0 to 70.0, and z is in a range from 0.1 to 9.6. Catalyst described herein are useful, for example, in fuel cell membrane electrode assemblies.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a national stage filing under 35 U.S.C. 371 of PCT/US2017/056103, filed Oct. 11, 2017, which claims the benefit of U.S. Provisional Application No. 62/413,173, filed Oct. 26, 2016, the disclosure of which is incorporated by reference in its/their entirety herein.

BACKGROUND

Fuel cells produce electricity via electrochemical oxidation of a fuel and reduction of an oxidant. Fuel cells are generally classified by the type of electrolyte and the type of fuel and oxidant reactants. One type of fuel cell is a polymer electrolyte membrane fuel cell (PEMFC), where the electrolyte is a polymeric ion conductor and the reactants are hydrogen fuel and oxygen as the oxidant. The oxygen is often provided from the ambient air.

PEMFCs typically require the use of electrocatalysts to improve the reaction rate of the hydrogen oxidation reaction (HOR) and oxygen reduction reactions (ORR), which improve the PEMFC performance. PEMFC electrocatalysts often comprise platinum, a relatively expensive precious metal. It is typically desirable to minimize the platinum content in PEMFCs, increasing the catalyst activity per unit catalyst surface area (specific activity) and increasing the catalyst surface area per catalyst mass (specific surface area or specific area). The HOR and ORR occur on the catalyst surface, so increasing the specific surface area and/or the specific activity can reduce the devices' total (precious metal) catalyst loading to minimize cost. Sufficient platinum content, however, is needed to provide sufficient catalytic activity and PEMFC device performance. As such, there is a desire to increase the catalyst activity per unit catalyst mass (mass activity). There are two general approaches to increase the mass activity, namely the amount of catalyst needed to achieve a desired absolute performance, reducing cost.

To maximize specific area, PEMFC electrocatalysts are often in the form of nanometer-scale thin films or particles on support materials. An exemplary support material for nanoparticle PEMFC electrocatalysts is carbon black, and an exemplary support material for thin film electrocatalysts is whiskers.

To increase the specific activity, PEMFC Pt ORR electrocatalysts often also comprise certain transition metals such as cobalt or nickel. Without being bound by theory, incorporation of certain transition metals into the Pt lattice is believed to induce contraction of the Pt atoms at the catalyst surface, which increases the kinetic reaction rate by modification of the molecular oxygen binding and dissociation energies and the binding energies of reaction intermediates and/or spectator species.

PEMFC electrocatalysts may incorporate other precious metals. For example, HOR PEMFC Pt electrocatalysts can be alloyed with ruthenium to improve tolerance to carbon monoxide, a known Pt catalyst poison. HOR and ORR PEMFC electrocatalysts may also incorporate iridium to facilitate improved activity for the oxygen evolution reaction (OER). Improved OER activity may improve the durability of the PEMFC under inadvertent operation in the absence of fuel and during PEMFC system startup and shutdown. Incorporation of iridium into the PEMFC ORR electrocatalyst, however, may result in decreased mass activity and higher catalyst cost. Iridium has relatively lower specific activity for ORR than platinum, potentially resulting in decreased mass activity. Iridium is also a precious metal, and thereby its incorporation can increase cost. PEMFC Pt electrocatalysts may also incorporate gold. Gold is known to be relatively inactive for HOR and ORR in acidic electrolytes. Incorporation of gold can result in substantial deactivation for HOR and ORR due to the propensity for gold to preferentially segregate to the electrocatalyst surface, blocking active catalytic sites.

PEMFC electrocatalysts may have different structural and compositional morphologies. The structural and compositional morphologies are often tailored through specific processing methods during the electrocatalyst fabrication, such as variations in the electrocatalyst deposition method and annealing methods. PEMFC electrocatalysts can be compositionally homogenous, compositionally layered, or may contain composition gradients throughout the electrocatalyst. Tailoring of composition profiles within the electrocatalyst may improve the activity and durability of electrocatalysts. PEMFC electrocatalyst particles or nanometer-scale films may have substantially smooth surfaces or have atomic or nanometer-scale roughness. PEMFC electrocatalysts may be structurally homogenous or may be nanoporous, being comprised of nanometer-scale pores and solid catalyst ligaments.

As compared to structurally homogenous electrocatalysts, nanoporous PEMFC electrocatalysts may have higher specific area, thereby reducing cost. Nanoporous catalysts are comprised of numerous interconnected nanoscale catalyst ligaments, and the surface area of a nanoporous material depends upon the diameter and volumetric number density of the nanoscale ligaments. Surface area is expected to increase as the nanoscale ligament diameter decreases and the volumetric number density increases.

One method of forming nanoporous PEMFC electrocatalysts is via dealloying of a transition metal rich Pt alloy precursor, such as a PtNi alloy with 30 at. % Pt and 70 at. % Ni. During dealloying, the precursor is exposed to conditions where the transition metal is dissolved and the surface Pt has sufficient mobility to allow exposure of subsurface transition metal and formation of nanoscale ligaments, which separate the nanopores. Dealloying to form nanopores can be induced via free corrosion approaches, such as exposure to acid or via exposure to repeated electrochemical oxidation and reduction cycles. Electrocatalyst nanopore formation may occur spontaneously during electrochemical operation within a PEMFC or may occur via ex-situ processing prior to PEMFC operation.

In PEMFC devices, electrocatalysts may lose performance over time due to a variety of degradation mechanisms, which induce structural and compositional changes. Such performance loss may shorten the practical lifetime of such systems. Electrocatalyst degradation may occur, for example, due to loss of electrocatalyst activity per unit surface area and loss of electrocatalyst surface area. Electrocatalyst specific activity may be lost, for example, due to the dissolution of electrocatalyst alloying elements. Non-porous nanoparticle and nano-scale thin films may lose surface area, for example, due to Pt dissolution, particle sintering, and loss of surface roughness. Nanoporous electrocatalysts may additionally lose surface area, for example, due to increased nanoscale ligament diameter and decreased nanoscale ligament density.

Additional electrocatalysts and systems containing such catalysts are desired, including those that address one or more of the issues discussed above.

SUMMARY

In one aspect, the present disclosure provides a catalyst comprising nanostructured element comprising microstructured whiskers having an outer surface at least partially covered by a catalyst material having the formula Pt_(x)Ni_(y)Au_(z), wherein x is in a range from 27.3 to 29.9, y is in a range from 63.0 to 70.0, and z is in a range from 0.1 to 9.6 (in some embodiments, x is in a range from 29.4 to 29.9, y is in a range from 68.9 to 70.0, and z is in a range from 0.1 to 2.0; or even x is in a range from 29.7 to 29.9, y is in a range from 69.4 to 70.0, and z is in a range from 0.1 to 0.9). In some embodiments, the catalyst material functions as an oxygen reduction catalyst material.

In some embodiments, at least some layers comprising platinum and nickel have been dealloyed to remove nickel from at least one layer. In some embodiments, there are pores with diameters in a range from 1 nm to 10 nm (in some embodiments, in a range from 2 nm to 8 nm, or even 3 nm to 7 nm) where the nickel was removed.

In some embodiments, catalysts described herein have been annealed.

Surprisingly, Applicants discovered the addition of gold to PtNi catalyst can substantially improve retention of mass activity, specific area, and/or performance after accelerated electrocatalyst aging. Gold was observed to improve the durability, whether incorporated into the bulk of the catalysts or at the surface of the catalyst, whether incorporated into the catalyst before or after annealing, and whether incorporated into or at the surface of the catalyst before or after nanoporosity was formed via dealloying.

Catalysts described herein are useful, for example, in fuel cell membrane electrode assemblies.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a side view of an exemplary catalyst described herein.

FIG. 2 is a schematic of an exemplary fuel cell.

FIG. 3A is a plot of the electrocatalyst mass activity of Examples 1-5 and Comparative Example A catalysts, normalized to platinum content.

FIG. 3B is a plot of the electrocatalyst activity of Examples 1-5 and Comparative Example A catalysts, normalized to total platinum group metal content.

FIG. 3C is a plot of the electrocatalyst surface area of Examples 1-5 and Comparative Example A catalysts, normalized to platinum content.

FIG. 3D is a plot of the electrocatalyst surface area Examples 1-5 and Comparative Example A catalysts, normalized to total platinum group metal content.

FIG. 3E is a plot of fuel cell performance of Examples 1-5 and Comparative Example A catalysts.

DETAILED DESCRIPTION

Referring to FIG. 1, exemplary catalyst described herein 100 on substrate 108 has nanostructured elements 102 with microstructured whiskers 104 having outer surface 105 at least partially covered by catalyst material 106 having the formula Pt_(x)Ni_(y)Au_(z), wherein x is in a range from 27.3 to 29.9, y is in a range from 63.0 to 70.0, and z is in a range from 0.1 to 9.6 (in some embodiments, x is in a range from 29.4 to 29.9, y is in a range from 68.9 to 70.0, and z is in a range from 0.1 to 2.0; or even x is in a range from 29.7 to 29.9, y is in a range from 69.4 to 70.0, and z is in a range from 0.1 to 0.9).

Suitable whiskers can be provided by techniques known in the art, including those described in U.S. Pat. No. 4,812,352 (Debe), U.S. Pat. No. 5,039,561 (Debe), U.S. Pat. No. 5,338,430 (Parsonage et al.), U.S. Pat. No. 6,136,412 (Spiewak et al.), and U.S. Pat. No. 7,419,741 (Vernstrom et al.), the disclosures of which are incorporated herein by reference. In general, nanostructured whiskers can be provided, for example, by vacuum depositing (e.g., by sublimation) a layer of organic or inorganic material onto a substrate (e.g., a microstructured catalyst transfer polymer sheet), and then, in the case of perylene red deposition, converting the perylene red pigment into nanostructured whiskers by thermal annealing. Typically, the vacuum deposition steps are carried out at total pressures at or below about 10⁻³ Torr or 0.1 Pascal. Exemplary microstructures are made by thermal sublimation and vacuum annealing of the organic pigment C.I. Pigment Red 149 (i.e., N,N′-di(3,5-xylyl)perylene-3,4:9,10-bis(dicarboximide)). Methods for making organic nanostructured layers are reported, for example, in Materials Science and Engineering, A158 (1992), pp. 1-6; J. Vac. Sci. Technol. A, 5, (4), July/August 1987, pp. 1914-16; J. Vac. Sci. Technol. A, 6, (3), May/August 1988, pp. 1907-11; Thin Solid Films, 186, 1990, pp. 327-47; J. Mat. Sci., 25, 1990, pp. 5257-68; Rapidly Quenched Metals, Proc. of the Fifth Int. Conf. on Rapidly Quenched Metals, Wurzburg, Germany (Sep. 3-7, 1984), S. Steeb et al., eds., Elsevier Science Publishers B.V., New York, (1985), pp. 1117-24; Photo. Sci. and Eng., 24, (4), July/August 1980, pp. 211-16; and U.S. Pat. No. 4,340,276 (Maffitt et al.) and U.S. Pat. No. 4,568,598 (Bilkadi et al.), the disclosures of which are incorporated herein by reference. Properties of catalyst layers using carbon nanotube arrays are reported in the article “High Dispersion and Electrocatalytic Properties of Platinum on Well-Aligned Carbon Nanotube Arrays”, Carbon, 42, (2004), pp. 191-197. Properties of catalyst layers using grassy or bristled silicon are reported, for example, in U.S. Pat. App. Pub. No. 2004/0048466 A1 (Gore et al.).

Vacuum deposition may be carried out in any suitable apparatus (see, e.g., U.S. Pat. No. 5,338,430 (Parsonage et al.), U.S. Pat. No. 5,879,827 (Debe et al.), U.S. Pat. No. 5,879,828 (Debe et al.), U.S. Pat. No. 6,040,077 (Debe et al.), and U.S. Pat. No. 6,319,293 (Debe et al.), and U.S. Pat. App. Pub. No. 2002/0004453 A1 (Haugen et al.), the disclosures of which are incorporated herein by reference). One exemplary apparatus is depicted schematically in FIG. 4A of U.S. Pat. No. 5,338,430 (Parsonage et al.), and discussed in the accompanying text, wherein the substrate is mounted on a drum, which is then rotated over a sublimation or evaporation source for depositing the organic precursor (e.g., perylene red pigment) prior to annealing the organic precursor in order to form the whiskers.

Typically, the nominal thickness of deposited perylene red pigment is in a range from about 50 nm to 500 nm. Typically, the whiskers have an average cross-sectional dimension in a range from 20 nm to 60 nm and an average length in a range from 0.3 micrometer to 3 micrometers.

In some embodiments, the whiskers are attached to a backing. Exemplary backings comprise polyimide, nylon, metal foils, or other materials that can withstand the thermal annealing temperature up to 300° C. In some embodiments, the backing has an average thickness in a range from 25 micrometers to 125 micrometers.

In some embodiments, the backing has a microstructure on at least one of its surfaces. In some embodiments, the microstructure is comprised of substantially uniformly shaped and sized features at least three (in some embodiments, at least four, five, ten, or more) times the average size of the whiskers. The shapes of the microstructures can, for example, be V-shaped grooves and peaks (see, e.g., U.S. Pat. No. 6,136,412 (Spiewak et al.), the disclosure of which is incorporated herein by reference) or pyramids (see, e.g., U.S. Pat. No. 7,901,829 (Debe et al.), the disclosure of which is incorporated herein by reference). In some embodiments, some fraction of the microstructure features extend above the average or majority of the microstructured peaks in a periodic fashion, such as every 31^(st) V-groove peak being 25% or 50% or even 100% taller than those on either side of it. In some embodiments, this fraction of features that extends above the majority of the microstructured peaks can be up to 10% (in some embodiments up to 3%, 2%, or even up to 1%). Use of the occasional taller microstructure features may facilitate protecting the uniformly smaller microstructure peaks when the coated substrate moves over the surfaces of rollers in a roll-to-roll coating operation. The occasional taller feature touches the surface of the roller rather than the peaks of the smaller microstructures, so much less of the nanostructured material or whisker material is likely to be scraped or otherwise disturbed as the substrate moves through the coating process. In some embodiments, the microstructure features are substantially smaller than half the thickness of the membrane that the catalyst will be transferred to in making a membrane electrode assembly. This is so that during the catalyst transfer process, the taller microstructure features do not penetrate through the membrane where they may overlap the electrode on the opposite side of the membrane. In some embodiments, the tallest microstructure features are less than ⅓^(rd) or ¼^(th) of the membrane thickness. For the thinnest ion exchange membranes (e.g., about 10 micrometers to 15 micrometers in thickness), it may be desirable to have a substrate with microstructured features no larger than about 3 micrometers to 4.5 micrometers tall. The steepness of the sides of the V-shaped or other microstructured features or the included angles between adjacent features may, in some embodiments, be desirable to be on the order of 90° for ease in catalyst transfer during a lamination-transfer process and to have a gain in surface area of the electrode that comes from the square root of two (1.414) surface area of the microstructured layer relative to the planar geometric surface of the substrate backing.

In some embodiments, the catalyst material comprises a layer comprising platinum and nickel and a layer comprising gold on the layer comprising platinum and nickel.

In some embodiments, layers comprising platinum and nickel have a planar equivalent thickness in a range from 0.4 nm to 70 nm (in some embodiments, in a range from 0.4 nm to 1 nm, 0.4 nm to 5 nm, 1 nm to 25 nm, or even 1 nm to 10 nm) and layers comprising gold have a planar equivalent thickness (i.e., the thickness if deposited on a substantially flat, planar substrate) in a range from 0.01 nm to 20 nm (in some embodiments, in a range from 0.01 nm to 10 nm, 0.01 nm to 5 nm, 0.02 nm to 2.5 nm, or even 0.02 nm to 1 nm). In some embodiments, the layer(s) comprising platinum and nickel collectively has a planar equivalent thickness up to 600 nm (in some embodiments, up to 575 nm, 550 nm, 500 nm, 400 nm, 300 nm, 200 nm, 100 nm, 75 nm, 50 nm, 25 nm, 10 nm, 5 nm, 2.5 nm, 1 nm, or even up to two monolayers (e.g., 0.4 nm); in some embodiments, in a range from 0.4 nm to 600 nm, 0.4 nm to 500 nm, 1 nm to 500 nm, 5 nm to 500 nm, 10 nm to 500 nm, 10 nm to 400 nm, or even 40 nm to 300 nm) and the layer comprising gold has a planar equivalent thickness up to 50 nm (in some embodiments, up to 45 nm, 40 nm, 35 nm, 30 nm, 25 nm, 20 nm, 15 nm, 10 nm, 5 nm, 4 nm, 3 nm, 2 nm, 1 nm, a monolayer (e.g., 0.2 nm) or even less than a monolayer (e.g., 0.01 nm); in some embodiments, in a range from 0.01 nm to 50 nm, 1 nm to 50 nm, 5 nm to 40 nm, or even 5 nm to 35 nm).

In some embodiments, the catalyst material comprises alternating layers comprising platinum and nickel and layers comprising gold (i.e., a layer comprising platinum and nickel, a layer comprising gold, a layer comprising platinum and nickel, a layer comprising gold, etc.). In some embodiments, at least 2, 3, 4, 5, 10, 15, 20, 25, 50, 75, 100, 150, 200, 250, or even at least 275 sets of the alternating layers.

The thickness of an individual deposited catalyst layer may depend, for example, on the areal catalyst loading of the layer and the catalyst density. For example, the thickness of a single layer of Pt with 10 micrograms of Pt per cm² planar area and density of 21.45 g/cm³ deposited onto a planar substrate is calculated as 4.7 nm, and the thickness of a Ni layer with the same areal loading is 11.2 nm.

In some embodiments, the catalyst material comprises a layer comprising platinum, a layer comprising nickel on the layer comprising platinum, and a layer comprising gold on the layer comprising nickel. In some embodiments, the catalyst material comprises a layer comprising nickel, a layer comprising platinum on the layer comprising nickel, and a layer comprising gold on the layer comprising platinum. In some embodiments, the catalyst material comprises repeating sequential individual layers of platinum, nickel, and gold. In some embodiments, at least 2, 3, 4, 5, 10, 15, 20, 25, 50, 75, 100, 150, 200, 250, or even at least 275 sets of the repeating layers.

In some embodiments, the catalyst material has an exposed gold surface layer.

In some embodiments, each layer independently has a planar equivalent thickness up to 100 nm (in some embodiments, up to 50 nm, 20 nm, 15 nm, 10 nm, 5 nm, 4 nm, 3 nm, 2 nm, 1 nm, a monolayer (e.g., 0.2 nm), or even up to less than a monolayer (e.g. 0.01 nm); in some embodiments, in a range from 0.01 nm to 100 nm, 0.01 nm to 50 nm, 0.1 nm to 15 nm, 0.1 nm to 10 nm, or even 1 nm to 5 nm).

In general, the catalyst can be deposited by techniques known in the art. Exemplary deposition techniques include those independently selected from the group consisting of sputtering (including reactive sputtering), atomic layer deposition, molecular organic chemical vapor deposition, molecular beam epitaxy, thermal physical vapor deposition, vacuum deposition by electrospray ionization, and pulse laser deposition. Additional general details can be found, for example, in U.S. Pat. No. 5,879,827 (Debe et al.), U.S. Pat. No. 6,040,077 (Debe et al.), and. U.S. Pat. No. 7,419,741 (Vernstrom et al.), the disclosures of which are incorporated herein by reference. The thermal physical vapor deposition method uses suitable elevated temperature (e.g., via resistive heating, electron beam gun, or laser) to melt or sublimate the target (source material) into a vapor state, which is in turn passed through a vacuum space, then condensing of the vaporized form onto substrate surfaces. Thermal physical vapor deposition equipment is known in the art, including that available, for example, as a metal evaporator or as an organic molecular evaporator from CreaPhys GmbH, Dresden, Germany, under the trade designations “METAL EVAPORATOR (ME-SERIES)” or “ORGANIC MOLECULAR EVAPORATOR (DE-SERIES)” respectively; another example of an organic materials evaporator is available from Mantis Deposition LTD, Oxfordshire, UK, under the trade designation “ORGANIC MATERIALS EVAPORATOR (ORMA-SERIES).” Catalyst material comprising multiple alternating layers can be sputtered, for example, from multiple targets (e.g., Pt is sputtered from a first target, Ni is sputtered from a second target, and Au from a third, or from a target(s) comprising more than one element (e.g., Pt and Ni)). If the catalyst coating is done with a single target, it may be desirable that the coating layer be applied in a single step onto the gas distribution layer, gas dispersion layer, catalyst transfer layer, or membrane, so that the heat of condensation of the catalyst coating heats the underlying catalyst or support Pt, Ni, or Ir atoms as applicable and a substrate surface sufficient to provide enough surface mobility that the atoms are well mixed and form thermodynamically stable alloy domains. Alternatively, for example, the substrate can also be provided hot or heated to facilitate this atomic mobility. In some embodiments, sputtering is conducted at least in part in an atmosphere comprising argon. Organometallic forms of catalysts can be deposited, for example, by soft or reactive landing of mass-selected ions. Soft landing of mass-selected ions is used to transfer catalytically-active metal complexes complete with organic ligands from the gas phase onto an inert surface. This method can be used to prepare materials with defined active sites and thus achieve molecular design of surfaces in a highly controlled way under either ambient or traditional vacuum conditions. For additional details see, for example, Johnson et al., Anal. Chem., 2010, 82, pp. 5718-5727, and Johnson et al., Chemistry: A European Journal, 2010, 16, pp. 14433-14438, the disclosures of which are incorporated herein by reference.

In some embodiments, the weight ratio of platinum to gold is in a range from 3:1 to 250:1 (in some embodiments, in a range from 5:1 to 15:1, from 3:1 to 30:1, from 30:1 to 250:1, or even 15:1 to 250:1).

In some embodiments, methods for making catalyst described herein comprise depositing platinum and nickel from a target comprising platinum and nickel (e.g., a Pt₃Ni₇ target) and depositing gold from a target comprising gold. In some embodiments, layers comprising platinum and nickel have a planar equivalent thickness in a range from 0.4 nm to 580 nm (in some embodiments, in a range from 0.4 nm to 72 nm) and layers comprising gold have a planar equivalent thickness in a range from 0.01 nm to 32 nm (in some embodiments, in a range from 0.01 nm to 16 nm, or even a range from 0.01 nm to 2 nm).

In some embodiments, methods for making catalyst described herein comprise depositing platinum from a target comprising platinum, depositing nickel from a target comprising nickel, and depositing gold from a target comprising gold. In some embodiments, a layer comprising platinum, an adjacent layer comprising nickel, and an adjacent layer comprising gold collectively have a planar equivalent thickness in a range from 0.5 nm to 50 nm (in some embodiments, in a range from 0.5 nm to 30 nm). In some embodiments, layers comprising platinum have a planar equivalent thickness in a range from 0.2 nm to 30 nm (in some embodiments, in a range from 0.2 nm to 20 nm, or even 0.2 nm to 10 nm), layers comprising nickel have a planar equivalent thickness in a range from 0.2 nm to 50 nm (in some embodiments, in a range from 0.2 nm to 25 nm, or even 0.2 nm to 10 nm) and layers comprising gold have a planar equivalent thickness in a range from 0.01 nm to 20 nm (in some embodiments, in a range from 0.01 nm to 10 nm, 0.01 nm to 5 nm, 0.02 nm to 5 nm, 0.02 nm to 1 nm, or even 0.1 nm to 1 nm). In some embodiments, the weight ratio of platinum to gold is in a range from 3:1 to 250:1 (in some embodiments, in a range from 5:1 to 15:1, from 3:1 to 30:1, from 30:1 to 250:1, or even 15:1 to 250:1).

In some embodiments, at least one layer comprising platinum and nickel (including a layer(s) comprising platinum and nickel or a layer comprising platinum, nickel, and gold) is nanoporous (e.g., pores with diameters in a range from 1 nm to 10 nm (in some embodiments, in a range from 2 nm to 8 nm, or even 3 nm to 7 nm)). In some embodiments, at least 2, 3, 4, 5, 10, 15, 20, 25, 50, 75, 100, 150, 200, 250, or even at least 275 layers comprising platinum and nickel are nanoporous.

The nanoporosity can be provided by dealloying the catalyst material to remove a portion of the nickel. In general, dealloying can be accomplished by techniques known in the art, including via “free-corrosion” approaches (e.g., immersion in acid) or via electrochemical processing (e.g., potential cycling in acidic media). Nanoporosity formation typically occurs in alloys comprising at least two components with sufficiently different dissolution rates in the dealloying medium and when the more noble component has sufficient surface mobility. For additional details see, for example, Erlebacher et al., Nature, 2001, 410, pp. 450-453; and U.S. Pat. No. 6,805,972 B2 (Erlebacher et al.); U.S. Pat. No. 8,673,773 B2 (Opperman et al.); and U.S. Pat. No. 8,895,206 B2 (Erlebacher et al.), the disclosures of which are incorporated herein by reference.

In some embodiments, the catalyst material is annealed. In some embodiments, the catalyst is annealed before dealloying. In general, annealing can be done by techniques known in the art, including heating the catalyst material via, for example, in an oven or furnace, with a laser, and with infrared techniques. Annealing can be conducted, for example, in inert or reactive gas environments. Although not wanting to be bound by theory, it is believed annealing can induce structural changes on the atomic scale, which can influence activity and durability of catalysts. Further, it is believed annealing nanoscale particles and films can induce mobility in the atomic constituent(s), which can cause growth of particles or thin film grains. In the case of multi-element mixtures, alloys, or layered particles and films, it is believed annealing can induce, for example, segregation of components within the particle or film to the surface, formation of random, disordered alloys, and formation of ordered intermetallics, depending upon the component element properties and the annealing environment. For additional details regarding annealing see, for example, van der Vliet et al., Nature Materials, 2012, 11, pp. 1051-1058; Wang et al., Nature Materials, 2013, 12, pp. 81-87, and U.S. Pat. No. 8,748,330 B2 (Debe et al.), the disclosures of which are incorporated herein by reference.

In some embodiments, methods for making catalysts described herein comprise:

depositing platinum and nickel from a target comprising platinum and nickel to provide at least one layer comprising platinum and nickel (in some embodiments, repeatedly depositing from the target to provide multiple layers);

dealloying at least one layer comprising platinum and nickel to remove nickel from at least one layer; and

depositing a layer comprising gold from a target comprising gold. In some embodiments, there are pores with diameters in a range from 1 nm to 10 nm (in some embodiments, in a range from 2 nm to 8 nm, or even 3 nm to 7 nm) where the nickel was removed. In some embodiments, the target is a Pt₃Ni₇ target.

In some embodiments, methods for making catalysts described herein comprise:

depositing platinum from a target comprising platinum to provide at least one layer comprising platinum;

depositing nickel from a target comprising nickel to provide at least one layer comprising nickel;

dealloying at least one layer comprising platinum and nickel to remove nickel from at least one layer; and

depositing a layer comprising gold from a target comprising gold. In some embodiments, depositing the layers to provide alternating layers respectively comprising platinum or nickel. In some embodiments, there are pores with diameters in a range from 1 nm to 10 nm (in some embodiments, in a range from 2 nm to 8 nm, or even 3 nm to 7 nm) where the nickel was removed.

In some embodiments, methods for making catalysts described herein comprise:

depositing platinum and nickel from a target comprising platinum and nickel to provide a first layer comprising platinum and nickel;

depositing a layer comprising gold from a target comprising gold;

repeating the preceding two steps, in order, at least once (in some embodiments, repeating 2, 3, 4, 5, 10, 15, 20, 25, 50, 75, 100, 150, 200, 250, or even at least 275 times); and

dealloying at least one layer comprising platinum and nickel to remove nickel from the layer. In some embodiments, there are pores with diameters in a range from 1 nm to 10 nm (in some embodiments, in a range from 2 nm to 8 nm, or even 3 nm to 7 nm) where the nickel was removed. In some embodiments, the target is a Pt₃Ni₇ target.

Catalysts described herein are useful, for example, in fuel cell membrane electrode assemblies (MEAs). “Membrane electrode assembly” refers to a layered sandwich of fuel cell materials comprising a membrane, anode and cathode electrode layers, and gas diffusion layers. Typically, the cathode catalyst layer comprises a catalyst described herein, although in some embodiments, the anode catalyst layer independently comprises a catalyst described herein.

An MEA comprises, in order:

a first gas distribution layer having first and second opposed major surfaces;

an anode catalyst layer having first and second opposed major surfaces, the anode catalyst comprising a first catalyst;

an electrolyte membrane;

a cathode catalyst layer having first and second opposed major surfaces, the cathode catalyst comprising a second catalyst; and

a second gas distribution layer having first and second opposed major surfaces.

Electrolyte membranes conduct reaction intermediate ions between the anode and cathode catalyst layers. Electrolyte membranes preferably have high durability in the electrochemical environment, including chemical and electrochemical oxidative stability. Electrolyte membranes preferably have low ionic resistance for the transport of the reaction intermediate ions, but are relatively impermeable barriers for other ions, electrons, and reactant species. In some embodiments, the electrolyte membrane is a proton exchange membrane (PEM), which conducts cations. In PEM fuel cells, the electrolyte membrane preferably conducts protons. PEMs are typically a partially fluorinated or perfluorinated polymer comprised of a structural backbone and pendant cation exchange groups, PEMs, are available, for example, from E. I. du Pont de Nemours and Company, Wilmington, Del., under the trade designation “NAFION;” Solvay, Brussels, Belgium, under the trade designation “AQUIVION;” 3M Company, St. Paul, Minn., under the designation “3M PFSA MEMBRANE;” and Asahi Glass Co., Tokyo, Japan, under the trade designation “FLEMION.”

A gas distribution layer generally delivers gas evenly to the electrodes and, in some embodiments, conducts electricity. It also provides for removal of water in either vapor or liquid form, in the case of a fuel cell. Gas distribution layers are typically porous to allow reactant and product transport between the electrodes and the flow field. Sources of gas distribution layers include carbon fibers randomly oriented to form porous layers, as well as non-woven paper or woven fabrics. The non-woven carbon papers are available, for example, from Mitsubishi Rayon Co., Ltd., Tokyo, Japan, under the trade designation “GRAFIL U-105;” Toray Corp., Tokyo, Japan, under the trade designation “TORAY;” AvCarb Material Solutions, Lowell, Mass., under the trade designation “AVCARB;” SGL Group, the Carbon Company, Wiesbaden, Germany, under the trade designation “SIGRACET;” Freudenberg FCCT SE & Co. KG, Fuel Cell Component Technologies, Weinheim, Germany, under the trade designation “FREUDENBERG;” and Engineered Fibers Technology (EFT), Shelton, Conn., under the trade designation “SPECTRACARB GDL.” The woven carbon fabrics or cloths are available, for example, from Electro Chem Inc., Woburn, Mass., under the trade designations “EC-CC1-060” and “EC-AC-CLOTH;” NuVant Systems Inc., Crown Point, Ind., under the trade designations “ELAT-LT” and “ELAT;” BASF Fuel Cell GmbH, North America, under the trade designation “E-TEK ELAT LT;” and Zoltek Corp., St. Louis, Mo., under the trade designation “ZOLTEK CARBON CLOTH.” The non-woven paper or woven fabrics can be treated to modify its' hydrophobicity (e.g., treatment with a polytetrafluoroethylene (PTFE) suspension with subsequent drying and annealing). Gas dispersion layers often comprise a porous layer of sub-micrometer electronically-conductive particles (e.g., carbon), and a binder (e.g., PTFE). Although not wanting to be bound by theory, it is believed that gas dispersion layers facilitate reactant and product water transport between the electrode and the gas distribution layers.

At least one of the anode or cathode catalyst has whiskers with catalyst material described herein. The “other catalyst layer” can be a conventional catalyst known in the art, and provided by techniques known in the art (e.g., U.S. Pat. No. 5,759,944 (Buchanan et al.), U.S. Pat. No. 5,068,161 (Keck et al.), and U.S. Pat. No. 4,447,506 (Luczak et al.)), the disclosures of which are incorporated herein by reference.

In some embodiments, the cathode and/or anode catalyst layer comprises whiskers with catalyst material described herein.

A fuel cell is an electrochemical device that combines hydrogen fuel and oxygen from the air to produce electricity, heat, and water. Fuel cells do not utilize combustion, and as such, fuel cells produce little, if any, hazardous effluents. Fuel cells convert hydrogen fuel and oxygen directly into electricity, and can be operated at much higher efficiencies than can internal combustion electric generators, for example.

Referring to FIG. 2, exemplary fuel cell 200 includes first gas distribution layer 201 adjacent to anode 203. Adjacent anode 203 is an electrolyte membrane 204. Cathode 205 is situated adjacent electrolyte membrane 204, and second gas distribution layer 207 is situated adjacent cathode 205. In operation, hydrogen fuel is introduced into the anode portion of fuel cell 200, passing through first gas distribution layer 201 and over anode 203. At anode 203, the hydrogen fuel is separated into hydrogen ions (H) and electrons (e).

Electrolyte membrane 204 permits only the hydrogen ions or protons to pass through electrolyte membrane 204 to the cathode portion of fuel cell 200. The electrons cannot pass through electrolyte membrane 204 and, instead, flow through an external electrical circuit in the form of electric current. This current can power an electric load 217, such as an electric motor, or be directed to an energy storage device, such as a rechargeable battery.

Oxygen flows into the cathode side of fuel cell 200 via second distribution layer 207. As the oxygen passes over cathode 205, oxygen, protons, and electrons combine to produce water and heat.

Exemplary Embodiments

-   1A. A catalyst comprising nanostructured element comprising     microstructured whiskers having an outer surface at least partially     covered by a catalyst material having the formula     Pt_(x)Ni_(y)Au_(z), wherein x is in a range from 27.3 to 29.9, y is     in a range from 63.0 to 70.0, and z is in a range from 0.1 to 9.6     (in some embodiments, x is in a range from 29.4 to 29.9, y is in a     range from 68.9 to 70.0, and z is in a range from 0.1 to 2.0; or     even x is in a range from 29.7 to 29.9, y is in a range from 69.4 to     70.0, and z is in a range from 0.1 to 0.9). -   2A. The catalyst of Exemplary Embodiment 1A, wherein the catalyst     material comprises a layer comprising platinum and nickel and a     layer comprising gold on the layer comprising platinum and nickel. -   3A. The catalyst of Exemplary Embodiment 2A, wherein the layer(s)     comprising platinum and nickel collectively has a planar equivalent     thickness up to 600 nm (in some embodiments, up to 575 nm, 550 nm,     500 nm, 400 nm, 300 nm, 200 nm, 100 nm, 75 nm, 50 nm, 25 nm, 10 nm,     5 nm, 2.5 nm, 1 nm, or even up to two monolayers (e.g., 0.4 nm); in     some embodiments, in a range from 0.4 nm to 600 nm, 0.4 nm to 500     nm, 1 nm to 500 nm, 5 nm to 500 nm, 10 nm to 500 nm, 10 nm to 400     nm, or even 40 nm to 300 nm) and the layer comprising gold has a     planar equivalent thickness up to 50 nm (in some embodiments, up to     45 nm, 40 nm, 35 nm, 30 nm, 25 nm, 20 nm, 15 nm, 10 nm, 5 nm, 4 nm,     3 nm, 2 nm, 1 nm, a monolayer (e.g., 0.2 nm) or even less than a     monolayer (e.g., 0.01 nm); in some embodiments, in a range from 0.01     nm to 50 nm, 1 nm to 50 nm, 5 nm to 40 nm, or even 5 nm to 35 nm). -   4A. The catalyst of Exemplary Embodiment 3A, wherein each layer     independently has a planar equivalent thickness up to 100 nm (in     some embodiments, up to 50 nm, 20 nm, 15 nm, 10 nm, 5 nm, 4 nm, 3     nm, 2 nm, 1 nm, a monolayer (e.g., 0.2 nm), or even up to less than     a monolayer (e.g. 0.01 nm); in some embodiments, in a range from     0.01 nm to 100 nm, 0.01 nm to 50 nm, 0.1 nm to 15 nm, 0.1 nm to 10     nm, or even 1 nm to 5 nm). -   5A. The catalyst of Exemplary Embodiment 1A, wherein the catalyst     material comprises alternating layers comprising platinum and nickel     and layers comprising gold (i.e., a layer comprising platinum and     nickel, a layer comprising gold, a layer comprising platinum and     nickel, a layer comprising gold, etc.). In some embodiments, at     least 2, 3, 4, 5, 10, 15, 20, 25, 50, 75, 100, 150, 200, 250, or     even at least 275 sets of the alternating layers. -   6A. The catalyst of Exemplary Embodiment 5A, wherein each layer     independently has a planar equivalent thickness up to 100 nm (in     some embodiments, up to 50 nm, 20 nm, 15 nm, 10 nm, 5 nm, 4 nm, 3     nm, 2 nm, 1 nm, a monolayer (e.g., 0.2 nm), or even up to less than     a monolayer (e.g. 0.01 nm); in some embodiments, in a range from     0.01 nm to 100 nm, 0.01 nm to 50 nm, 0.1 nm to 15 nm, 0.1 nm to 10     nm, or even 1 nm to 5 nm). -   7A. The catalyst of Exemplary Embodiment 1A, wherein the catalyst     material comprises a layer comprising platinum, a layer comprising     nickel on the layer comprising platinum, and a layer comprising gold     on the layer comprising nickel. -   8A. The catalyst of Exemplary Embodiment 1A, wherein the catalyst     material comprises a layer comprising nickel, a layer comprising     platinum on the layer comprising nickel, and a layer comprising gold     on the layer comprising platinum. -   9A. The catalyst of any preceding A Exemplary Embodiment, wherein at     least one layer comprising both platinum and nickel is nanoporous.     In some embodiments, at least 2, 3, 4, 5, 10, 15, 20, 25, 50, 75,     100, 150, 200, 250, or even at least 275 layers comprising platinum     and nickel are nanoporous (e.g., pores with diameters in a range     from 1 nm to 10 nm (in some embodiments, in a range from 2 nm to 8     nm, or even 3 nm to 7 nm)). -   10A. The catalyst of any preceding A Exemplary Embodiment having an     exposed gold surface layer. -   11A. The catalyst of Exemplary Embodiment 1A, wherein the catalyst     material comprises repeating sequential individual layers of     platinum, nickel, and gold. In some embodiments, at least 2, 3, 4,     5, 10, 15, 20, 25, 50, 75, 100, 150, 200, 250, or even at least 275     sets of the repeating layers. -   12A. The catalyst of Exemplary Embodiment 11A, wherein at least one     layer comprising platinum, nickel, and gold is nanoporous. In some     embodiments, at least 2, 3, 4, 5, 10, 15, 20, 25, 50, 75, 100, 150,     200, 250, or even at least 275 layers comprising platinum, nickel,     and gold are nanoporous (e.g., pores with diameters in a range from     1 nm to 10 nm (in some embodiments, in a range from 2 nm to 8 nm, or     even 3 nm to 7 nm)). -   13A. The catalyst of any preceding A Exemplary Embodiment, wherein     the weight ratio of platinum to gold is in a range from 3:1 to 250:1     (in some embodiments, in a range from 5:1 to 15:1, from 3:1 to 30:1,     from 30:1 to 250:1, or even 15:1 to 250:1). -   14A. A fuel cell membrane electrode assembly comprising the catalyst     of any preceding A Exemplary Embodiment. -   1B. A method of dealloying a catalyst, the method comprising     dealloying at least some layers comprising platinum and nickel to     remove nickel from at least one layer to provide catalyst of     Exemplary Embodiments 1A to 13A. In some embodiments, there are     pores with diameters in a range from 1 nm to 10 nm (in some     embodiments, in a range from 2 nm to 8 nm, or even 3 nm to 7 nm)     where the nickel was removed. -   1C. A method comprising annealing the catalyst of Exemplary     Embodiment 1B before dealloying. -   1D. A method comprising annealing the catalyst of Exemplary     Embodiments 1A to 13A. -   1E. A method of making the catalyst of any of Exemplary Embodiments     1A to 13A, the method comprising depositing platinum and nickel from     a target comprising platinum and nickel and depositing gold from a     target comprising gold. -   2E. The method of Exemplary Embodiment 1E, wherein the target is a     Pt₃Ni₇ target. -   3E. The method of any preceding E Exemplary Embodiment, wherein     layers comprising platinum and nickel have a planar equivalent     thickness in a range from 0.4 nm to 580 nm (in some embodiments, in     a range from 0.4 nm to 72 nm) and layers comprising gold have a     planar equivalent thickness in a range from 0.01 nm to 32 nm (in     some embodiments, in a range from 0.01 nm to 16 nm, or even a range     from 0.01 nm to 2 nm). -   4E. The method of any preceding E Exemplary Embodiment, further     comprising dealloying at least some layers comprising platinum and     nickel to remove nickel from at least one layer. In some     embodiments, there are pores with diameters in a range from 1 nm to     10 nm (in some embodiments, in a range from 2 nm to 8 nm, or even 3     nm to 7 nm) where the nickel was removed. -   5E. The method of any of Exemplary Embodiments 1E to 3E, further     comprising annealing the catalyst. -   6E. The method of Exemplary Embodiment 5E, further comprising     dealloying at least a portion of the annealed catalyst. -   1F. A method of making the catalyst of any of Exemplary Embodiments     1A to 13A, the method comprising depositing platinum from a target     comprising platinum, depositing nickel from a target comprising     nickel, and depositing gold from a target comprising gold. -   2F. The method of Exemplary Embodiment 1F, wherein a layer     comprising platinum, an adjacent layer comprising nickel, and an     adjacent layer comprising gold collectively having a planar     equivalent thickness in a range from 0.5 nm to 50 nm (in some     embodiments, in a range from 0.5 nm to 30 nm). -   3F. The method of Exemplary Embodiment 1F, wherein layers comprising     platinum have a planar equivalent thickness in a range from 0.2 nm     to 30 nm (in some embodiments, in a range from 0.2 nm to 20 nm, or     even 0.2 nm to 10 nm), layers comprising nickel have a planar     equivalent thickness in a range from 0.2 nm to 50 nm (in some     embodiments, in a range from 0.2 nm to 25 nm, or even 0.2 nm to 10     nm) and layers comprising gold have a planar equivalent thickness in     a range from 0.01 nm to 20 nm (in some embodiments, in a range from     0.01 nm to 10 nm, 0.01 nm to 5 nm, 0.02 nm to 5 nm, 0.02 nm to 1 nm,     or even 0.1 nm to 1 nm). -   4F. The method of any preceding F Exemplary Embodiment, wherein the     weight ratio of platinum to gold is in a range from 3:1 to 250:1 (in     some embodiments, in a range from 5:1 to 15:1, from 3:1 to 30:1,     from 30:1 to 250:1, or even 15:1 to 250:1). -   5F. The method of any preceding F Exemplary Embodiment, further     comprising annealing the catalyst. -   6F. The method of any preceding F Exemplary Embodiment, further     comprising dealloying at least some layers comprising platinum and     nickel to remove nickel from at least one layer. In some     embodiments, there are pores with diameters in a range from 1 nm to     10 nm (in some embodiments, in a range from 2 nm to 8 nm, or even 3     nm to 7 nm) where the nickel was removed. -   1G. A method of making the catalyst of any of Exemplary Embodiments     1A to 13A, the method comprising:

depositing platinum and nickel from a target comprising platinum and nickel to provide at least one layer comprising platinum and nickel (in some embodiments, repeatedly depositing from the target to provide multiple layers);

dealloying at least one layer comprising platinum and nickel to remove nickel from at least one layer; and

depositing a layer comprising gold from a target comprising gold. In some embodiments, there are pores with diameters in a range from 1 nm to 10 nm (in some embodiments, in a range from 2 nm to 8 nm, or even 3 nm to 7 nm) where the nickel was removed.

-   2G. The method of Exemplary Embodiment 1G, further comprising     annealing the layers comprising platinum and nickel. -   3G. The method of any preceding G Exemplary Embodiment, wherein the     target is a Pt₃Ni₇ target. -   4G. The method of any preceding G Exemplary Embodiment, wherein     layers comprising platinum and nickel have a planar equivalent     thickness in a range from 0.4 nm to 70 nm (in some embodiments, in a     range from 0.4 nm to 1 nm, 0.4 nm to 5 nm, 1 nm to 25 nm, or even 1     nm to 10 nm) and layers comprising gold have a planar equivalent     thickness in a range from 0.01 nm to 20 nm (in some embodiments, in     a range from 0.01 nm to 10 nm, 0.01 nm to 5 nm, 0.02 nm to 2.5 nm,     or even 0.02 nm to 1 nm).

1H. A method of making the catalyst of any of Exemplary Embodiments 1A to 13A, the method comprising:

depositing platinum from a target comprising platinum to provide at least one layer comprising platinum;

depositing nickel from a target comprising nickel to provide at least one layer comprising nickel;

dealloying at least one layer comprising platinum and nickel to remove nickel from at least one layer; and

depositing a layer comprising gold from a target comprising gold. In some embodiments, depositing the layers to provide alternating layers respectively comprising platinum or nickel. In some embodiments, there are pores with diameters in a range from 1 nm to 10 nm (in some embodiments, in a range from 2 nm to 8 nm, or even 3 nm to 7 nm) where the nickel was removed.

-   2H. The method of Exemplary Embodiment 1H, further comprising     annealing the layers comprising at least one of platinum and nickel     before dealloying. -   3H. The method of any preceding H Exemplary Embodiment, wherein     layers comprising platinum and nickel have a planar equivalent     thickness in a range from 0.4 nm to 70 nm (in some embodiments, in a     range from 0.4 nm to 1 nm, 0.4 nm to 5 nm, 1 nm to 25 nm, or even 1     nm to 10 nm) and layers comprising gold have a planar equivalent     thickness in a range from 0.01 nm to 20 nm (in some embodiments, in     a range from 0.01 nm to 10 nm, 0.01 nm to 5 nm, 0.02 nm to 2.5 nm,     or even 0.02 nm to 1 nm). -   1I. A method of making the catalyst of any of Exemplary Embodiments     1A to 13A, the method comprising:

depositing platinum and nickel from a target comprising platinum and nickel to provide a first layer comprising platinum and nickel;

depositing a layer comprising gold from a target comprising gold;

repeating the preceding two steps, in order, at least once (in some embodiments, repeating 2, 3, 4, 5, 10, 15, 20, 25, 50, 75, 100, 150, 200, 250, or even at least 275 times); and

dealloying at least one layer comprising platinum and nickel to remove nickel from the layer. In some embodiments, there are pores with diameters in a range from 1 nm to 10 nm (in some embodiments, in a range from 2 nm to 8 nm, or even 3 nm to 7 nm) where the nickel was removed.

-   2I. The method of Exemplary Embodiment 1I, wherein the target is a     Pt₃Ni₇ target. -   3I. The method of any preceding I Exemplary Embodiment, further     comprising annealing the layers before dealloying. -   4I. The method of any preceding I Exemplary Embodiment, wherein     layers comprising platinum and nickel have a planar equivalent     thickness in a range from 0.4 nm to 70 nm (in some embodiments, in a     range from 0.4 nm to 1 nm, 0.4 nm to 5 nm, 1 nm to 25 nm, or even 1     nm to 10 nm) and layers comprising gold have a planar equivalent     thickness in a range from 0.01 nm to 20 nm (in some embodiments, in     a range from 0.01 nm to 10 nm, 0.01 nm to 5 nm, 0.02 nm to 2.5 nm,     or even 0.02 nm to 1 nm).

Advantages and embodiments of this invention are further illustrated by the following examples, but the particular materials and amounts thereof recited in these examples, as well as other conditions and details, should not be construed to unduly limit this invention. All parts and percentages are by weight unless otherwise indicated.

EXAMPLES Examples 1-4

Nanostructured whiskers employed as catalyst supports were made according to the process described in U.S. Pat. No. 5,338,430 (Parsonage et al.), U.S. Pat. No. 4,812,352 (Debe), and U.S. Pat. No. 5,039,561 (Debe), incorporated herein by reference, using as substrates the microstructured catalyst transfer substrates (or MCTS) described in U.S. Pat. No. 6,136,412 (Spiewak et al.), also incorporated herein by reference. Perylene red pigment (i.e., N,N′-di(3,5-xylyl)perylene-3,4:9,10-bis(dicarboximide)) (C.I. Pigment Red 149, also known as “PR149”, obtained from Clariant, Charlotte, N.C.) was sublimation vacuum coated onto MCTS with a nominal thickness of 200 nm, after which it was annealed. After deposition and annealing, highly oriented crystal structures were formed with large aspect ratios, controllable lengths of about 0.5 to 2 micrometers, widths of about 0.03-0.05 micrometer and areal number density of about 30 whiskers per square micrometer, and oriented substantially normal to the underlying substrate.

Nanostructured thin film (NSTF) catalyst layers were prepared by sputter coating catalyst films sequentially using a DC-magnetron sputtering process onto the layer of nanostructured whiskers. A vacuum sputter deposition system (obtained as Model Custom Research from Mill Lane Engineering Co., Lowell, Mass.) equipped with 4 cryo-pumps (obtained from Austin Scientific, Oxford Instruments, Austin, Tex.), a turbopump and using typical Ar sputter gas pressures of about 5 mTorr (0.66 Pa), and 2 inch×10 inch (5 cm×25.4 cm) rectangular sputter targets (obtained from Sophisticated Alloys, Inc., Butler, Pa.) was used. The coatings were deposited by using ultra high purity Ar as the sputtering gas. Pt and Ni were first simultaneously deposited from a single alloy Pt₃Ni₇ target (30 at. % Pt and 70 at. % Ni, obtained from Sophisticated Alloys, Butler, Pa.). 50 layers of Pt₃Ni₇ were deposited, each with about 2.8 nm planar equivalent thickness, resulting in an areal Pt loading of about 0.10 mg_(Pt)/cm². Pt₃Ni₇ catalysts deposited from a single alloy target are referred to as “single target” (ST). Au (obtained from Materion, Mayfield Heights, Ohio) was then subsequently deposited onto the surface of four pieces of the Pt₃Ni₇-coated NSTF catalyst on substrate, each with a different Au areal loading calculated to yield 1, 2, 5, and 10 at. % Au content in the electrocatalyst (Examples 1, 2, 3, and 4, respectively). The Au layer planar equivalent thickness for Examples 1, 2, 3, and 4 was 2.1 nm, 4.1 nm, 9.8 nm, and 20.2 nm, respectively. Pt-to-Au weight ratios for Examples 1, 2, 3, and 4 were 29.4:1, 14.7:1, 5.8:1, and 2.8:1, respectively.

Representative areas of the electrocatalysts were analyzed for bulk composition using X-Ray Fluorescence spectroscopy (XRF). Representative catalyst samples were evaluated on MCTS using a wavelength dispersive X-ray fluorescence spectrometer (obtained under the trade designation “PRIMUS II” from Rigaku Corporation, Tokyo, Japan) equipped with a rhodium (Rh) X-ray source, a vacuum atmosphere, and a 20 mm diameter measurement area. Each sample was analyzed three times to obtain the average and standard deviation for the measured Pt, Ni, and Au signal intensities, which are proportional to loading. The electrocatalysts' Pt, Ni, and Au areal loadings of Examples 1-4 were determined by comparing their measured XRF intensities to the XRF intensities obtained with standard NSTF electrocatalysts containing Pt, Ni, and Au with known areal loadings. From the XRF-determined Pt, Ni, and Au areal loadings, the catalysts' composition and Pt-to-Au weight ratios were calculated. The total platinum group metal (PGM) content was determined by adding the Pt and Au areal loadings. Loading and composition information is provided in Table 1, below.

TABLE 1 PtNi Au Loading (mg/cm²) Composition (at. %) Pt:Au Weight Example Deposition Incorporation Pt Ni Au PGM Pt Ni Au Ratio Comp. Ex. A ST None 0.104 0.073 0.000 0.104 30.0 70.0 0.0 Infinite Ex. 1 ST Top layer 0.111 0.077 0.004 0.114 29.8 69.2 1.0 29.4 Ex. 2 ST Top layer 0.110 0.077 0.008 0.118 29.4 68.6 2.0 14.7 Ex. 3 ST Top layer 0.111 0.078 0.019 0.130 28.5 66.6 4.9 5.8 Ex. 4 ST Top layer 0.111 0.077 0.039 0.150 27.3 63.0 9.6 2.8 Ex. 5 ST Bilayer 0.113 0.078 0.021 0.134 28.7 66.0 5.4 5.3

The Pt_(x)Ni_(y)Au_(z) catalysts and NSTF PtCoMn coated anode catalyst whiskers (0.05 mg_(Pt)/cm², Pt₆₉Co₂₈Mn₃) on MCTS were then transferred to either side of a 24-micrometer thick proton exchange membrane (available under the trade designation “3M PFSA 825EW” (neat) from 3M Company, St. Paul, Minn.), using a laminator (obtained under the trade designation “HL-101” from Chem Instruments, Inc., West Chester Township, Ohio) to form a catalyst coated membrane (CCM). The three-layer stack-up was hand fed into the laminator with hot nip rolls at 270° F. (132° C.), 150 psi (1.03 MPa) nip, and rotating at the equivalent of 0.5 fpm (0.25 cm/s). Immediately after lamination, the MCTS layers were peeled back, leaving the catalyst coated whiskers embedded into either side of the PEM. The CCM was installed with identical gas diffusion layers (available under the trade designation “3M 2979 GAS DIFFUSION LAYERS” from 3M Company) on the anode and cathode in 50 cm² active area test cells (obtained under the trade designation “50 CM2 CELL HARDWARE” from Fuel Cell Technologies, Inc., Albuquerque, N. Mex.) with quad-serpentine flow fields with gaskets selected to give 10% compression of the gas diffusion layers. The catalyst of the present invention was evaluated as the fuel cell cathode.

After assembly, the test cells were connected to a test station (obtained under the trade designation “SINGLE FUEL CELL TEST STATION” from Fuel Cell Technologies, Inc.). The MEA was then operated for about 40 hours under a conditioning protocol to achieve apparent steady state performance. The protocol consisted of repeated cycles of operational and shutdown phases, each about 40 and 45 minutes in duration, respectively. In the operational phase, the MEA was operated at 75° C. cell temperature, 70° C. dew point, 101/101 kPaA H₂/Air, with constant flow rates of 800 and 1800 sccm of H₂ and air, respectively. During the 40-minute operational phase, the cell voltage was alternated between 5-minute long polarization cycles between 0.85 V and 0.25 V and 5-minute long potential holds at 0.40 V. During the 45-minute shutdown phase, the cell potential was set to open circuit voltage, H₂ and air flows to the cell were halted, and the cell temperature was cooled towards room temperature, while liquid water was injected into the anode and cathode cell inlets at 0.26 g/min. and 0.40 g/min., respectively. Without being bound by theory, it is believed the fuel cell conditioning protocol, which includes numerous potential cycles, may induce formation of nanopores within the electrocatalyst.

After conditioning the MEAs, the electrocatalysts were characterized for relevant beginning of life (BOL) characteristics, including catalyst activity, surface area, and operational performance under relevant H₂/Air test conditions, described as follows.

The cathode oxygen reduction reaction (ORR) absolute activity was measured with saturated 150 kPaA H₂/O₂, 80° C. cell temperature for 1200 seconds at 900 mV vs. the 100% H₂ reference/counter electrode. The ORR absolute activity (A/cm² or mA/cm²) was obtained by adding the measured current density after 1050 seconds of hold time and the electronic shorting and hydrogen crossover current densities, estimated from 2 mV/s cyclic voltammograms measured with N₂ fed to the working electrode instead of O₂. The electrocatalyst mass activity, a measure of the catalyst activity per unit precious metal content, is calculated by dividing the corrected ORR absolute activity (A/cm² _(planar)) by the cathode Pt or PGM areal loading (mg/cm²) to obtain the mass activity (A/mg_(Pt) or A/mg_(PGM)). The electrocatalyst mass activity is provided in Table 2, below, and FIGS. 3A and 3B.

TABLE 2 Au ORR Mass H₂/Air Au Content Specific Area Activity Performance Example Incorporation at. % m₂/g_(Pt) m₂/g_(PGM) A/mg_(Pt) A/mg_(PGM) Volts Comp. Ex. A None 0 16.1 16.1 0.35 0.35 0.892 Ex. 1 Top layer 1.0 14.9 14.4 0.22 0.21 0.884 Ex. 2 Top layer 2.0 11.5 10.8 0.17 0.16 0.881 Ex. 3 Top layer 4.9 6.0 5.1 0.07 0.06 0.835 Ex. 4 Top layer 9.6 1.5 1.1 0.04 0.03 0.746 Ex. 5 Bilayer 5.4 9.8 8.2 0.15 0.12 0.878

The cathode catalyst surface enhancement factor (SEF, m² _(Pt)/m² _(planar) or analogously cm² _(Pt)/cm² _(planar)) was measured via cyclic voltammetry (100 mV/s, 0.65 V-0.85 V, average of 100 scans) under saturated 101 kilopascals absolute pressure (kPaA) H₂/N₂ and 70° C. cell temperature. The SEF was estimated by taking the average of the integrated hydrogen underpotential deposition (H_(UPD)) charge (μC/cm² _(planar)) for the oxidative and reductive waves and dividing by 220 μC/cm² _(Pt). The electrocatalyst's specific surface area (m² _(Pt)/g_(pt) or m² _(Pt)/g_(PGM)), a measure of catalyst dispersion, was calculated by dividing the SEF (m² _(Pt)/m² _(planar)) by the areal Pt or total platinum group metal (PGM) loading (g_(Pt)/m² _(planar or) g_(PGM)/m² _(planar)). The electrocatalyst's specific area is provided in Table 2, above, and FIGS. 3C and 3D.

The operational performance of electrocatalysts was evaluated via H₂/Air polarization curves, measured at 80° C. cell temperature, 68° C. dew point, 150/150 kPaA H₂/Air, with constant stoichiometry of 2.0H₂ and 2.5 for air. The current density was initially set to 20 mA/cm², and then stepwise increased while the cell voltage was maintained above 0.40 V, after which the current density was stepwise decreased back to 20 mA/cm². The cell was held at each current density for 2 minutes. The cell voltage at a specific current density, 20 mA/cm², is reported as “H₂/Air Performance” and is reported in Table 2, above, and FIG. 3E.

Example 2 catalyst was additionally evaluated under an accelerated stress test (AST), which evaluated the stability of the electrocatalyst metal. In this test, the cell was operated at 80° C. cell temperature, 200/200 sccm H₂/N₂, 101 kPaA, 100% inlet relative humidity (RH), and the cathode electrode potential was cycled between 0.6 V-1.0 V vs. the hydrogen counter/reference electrode at a scan rate of 50 mV/s. Without being bound by theory, it is believed the AST protocol, which includes numerous potential cycles, may induce formation of nanopores within the electrocatalyst. After 10 or 15 thousand AST cycles, the MEA was reconditioned for about 16 hours using the initial conditioning protocol, after which the cathode surface area, ORR activity, and H₂/Air polarization curves were again measured to determine the rate and extent of performance loss. This process of AST, reconditioning, and characterization was repeated such that the cell was exposed to a total of 30,000 AST cycles. The changes in specific area, mass activity, and H₂/Air performance after the 30,000 AST cycles are listed in Table 3, below.

TABLE 3 Au ORR Mass H₂/Air Au Content Specific Area Activity Performance Experiment Incorporation at. % m₂/g_(PGM) % Change A/mg_(PGM) % Change Volts Change Comp. Ex. A None 0 16.1 −39.5 0.35 −61.6 0.892 −0.037 Ex. 2 Top layer 2.0 10.8 −12.4 0.16 −37.5 0.881 −0.025 Ex. 5 Bilayer 5.4 8.2 −34.4 0.12 −42.5 0.878 −0.032

Example 5

Example 5 was prepared and evaluated as described for Examples 1-4, except that the Au metal was incorporated into the alloy during deposition of the Pt₃Ni₇.

A first “ST” Pt₃Ni₇ layer was deposited with about 1 nm planar equivalent thickness, onto which an Au layer was deposited. The Au planar equivalent thicknesses was about 0.08 nm. This deposition process was repeated 135 times until an areal Pt loading of about 0.10 mg_(Pt)/cm² was achieved.

Loading and composition information is provided in Table 1, above. The catalyst mass activity, specific area, and H₂/Air performance after initial conditioning are reported in Table 2, above, and shown in FIGS. 3A, 3B, 3C, 3D, and 3E. The changes in specific area, mass activity, and H₂/Air performance after the 30,000 AST cycles tested are listed in Table 3, above.

Comparative Example A

Comparative Example A was prepared and evaluated as described for Example 1, except that no Au was incorporated into the catalyst.

Loading and composition information is provided in Table 1, above. The catalyst specific area, mass activity, and H₂/Air performance after initial conditioning are reported in Table 2, above, and shown in FIGS. 3A, 3B, 3C, 3D, and 3E. The changes in specific area, mass activity, and H₂/Air performance after the 30,000 AST cycles tested are listed in Table 3, above.

Comparative Example B

Comparative Example B was prepared and evaluated as described for Comparative Example A, except that during electrocatalyst deposition the Pt₃Ni₇ loading and layer planar equivalent thickness differed and it was not evaluated under the AST durability test. Three layers of Pt₃Ni₇ were deposited, each with about 52 nm planar equivalent thickness, resulting in a Pt areal loading of about 0.125 mg_(Pt)/cm².

Loading and composition information is provided in Table 4, below.

TABLE 4 PtNi Au Loading (mg/cm²) Composition (at. %) Pt:Au Weight Example Deposition Incorporation Pt Ni Au PGM Pt Ni Au Ratio Comp. Ex. B ST None 0.125 0.088 0.000 0.125 29.9 70.1 0.0 Infinite Ex. 6 ST Top layer 0.125 0.088 0.0005 0.126 29.9 70.0 0.1 250 Ex. 7 ST Top layer 0.125 0.088 0.0010 0.126 29.9 69.9 0.2 125 Ex. 8 ST Top layer 0.125 0.088 0.0014 0.126 29.8 69.8 0.3 86.8 Ex. 9 ST Top layer 0.125 0.088 0.0019 0.127 29.8 69.7 0.5 64.4 Ex. 10 ST Top layer 0.125 0.088 0.0039 0.129 29.7 69.4 0.9 32.4

The catalyst specific area, mass activity, and H₂/Air performance after initial conditioning are reported in Table 5, below.

TABLE 5 Au ORR Mass H₂/Air Au Content Specific Area Activity Performance Example Incorporation at. % m₂/g_(Pt) m/g_(PGM) A/mg_(Pt) A/mg_(PGM) Volts Comp. Ex. B None 0.0 13.4 13.4 0.39 0.39 0.903 Ex. 6 Top layer 0.1 14.2 14.1 0.32 0.32 0.901 Ex. 7 Top layer 0.2 13.8 13.6 0.35 0.35 0.894 Ex. 8 Top layer 0.3 13.9 13.7 0.34 0.33 0.901 Ex. 9 Top layer 0.5 13.7 13.3 0.36 0.35 0.893 Ex. 10 Bilayer 0.9 13.4 13.4 0.39 0.39 0.903

Examples 6-10

Examples 6-10 were prepared and evaluated as described for Comparative Example B, except that Au was deposited onto the surface after deposition of Pt₃Ni₇, Au was deposited with an e-beam coater, and Au loading was determined within the e-beam coater.

For Example 6, a layer of Au was coated onto NSTF catalyst prepared above by using an e-beam coater equipment (obtained as Model MK-50, from CHA Industries, Fremont, Calif.). One planetary rotator mounted with NSTF catalyst as a substrate rotated inside the system under vacuum with the 270 degree electron beam heating the Au source to its sublimation point. As the Au sublimated, the deposited amount of Au and the deposition rate were monitored in real time using a quartz crystal monitor (obtained under the trade designation “INFICON;” Model 6000, from CHA Industries, Fremont, Calif.). Once the Au deposit loading of 0.5 microgram/cm² on the NSTF catalyst was attained, the power to the electron beam was terminated and the deposition ended. The system was then vented and the substrates removed. Examples 7, 8, 9, and 10 were prepared as described for Example 6, but the Au loadings were 1.0, 1.4, 1.9, and 3.9 microgram/cm², respectively.

Au content for Examples 6, 7, 8, 9, and 10 were 0.1, 0.2, 0.3, 0.5, and 0.9 at. %, respectively. Au layer planar equivalent thicknesses for Examples 6, 7, 8, 9, and 10 were 0.26 nm, 0.52 nm, 0.75 nm, 1.0 nm, and 2.0 nm, respectively. Pt-to-Au weight ratios for Examples 6, 7, 8, 9, and 10 were 250:1, 125:1, 86.8:1, 64.4:1, and 32.4:1, respectively.

Loading and composition information is provided in Table 4, above. The catalyst specific area, mass activity, and H₂/Air performance after initial conditioning are reported in Table 5, above.

Foreseeable modifications and alterations of this disclosure will be apparent to those skilled in the art without departing from the scope and spirit of this invention. This invention should not be restricted to the embodiments that are set forth in this application for illustrative purposes. 

What is claimed is:
 1. A catalyst comprising nanostructured element comprising microstructured whiskers having an outer surface at least partially covered by a catalyst material having the formula Pt_(x)Ni_(y)Au_(z), wherein x is in a range from 27.3 to 29.9, y is in a range from 63.0 to 70.0, and z is in a range from 0.1 to 9.6.
 2. The catalyst of claim 1, wherein x is in a range from 29.4 to 29.9, y is in a range from 68.6 to 70.0, and z is in a range from 0.1 to 2.0.
 3. The catalyst of claim 1, wherein the catalyst material comprises a layer comprising platinum and nickel and a layer comprising gold on the layer comprising platinum and nickel.
 4. The catalyst of claim 3, wherein each layer independently has a planar equivalent thickness up to 25 nm.
 5. The catalyst of claim 1, wherein the catalyst material comprises alternating layers comprising platinum and nickel and layers comprising gold.
 6. The catalyst of claim 5, wherein each layer independently has a planar equivalent thickness up to 25 nm.
 7. The catalyst of claim 1, wherein the catalyst material comprises a layer comprising platinum, a layer comprising nickel on the layer comprising platinum, and a layer comprising gold on the layer comprising nickel.
 8. The catalyst of claim 1, wherein the catalyst material comprises a layer comprising nickel, a layer comprising platinum on the layer comprising nickel, and a layer comprising gold on the layer comprising platinum.
 9. The catalyst of claim 1 having an exposed gold surface layer.
 10. The catalyst of claim 1, wherein the weight ratio of platinum to gold is in a range from 3:1 to 250:1.
 11. A fuel cell membrane electrode assembly comprising the catalyst of claim
 1. 12. A method comprising annealing the catalyst of claim
 1. 13. A method of making the catalyst of claim 1, the method comprising depositing platinum and nickel from a target comprising platinum and nickel and depositing gold from a target comprising gold.
 14. A method of making the catalyst of claim 1, the method comprising depositing platinum from a target comprising platinum, depositing nickel from a target comprising nickel, and depositing gold from a target comprising gold. 